The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2009
Filed:
Nov. 14, 2006
Tatsunari Mii, Tachikawa, JP;
Toshihiko Toyama, Tokorozawa, JP;
Hiroaki Yoshino, Akishima, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A wire bonding method including the steps of: descending a capillaryfrom above an external leadto press a wireto such an extent that the wire is not completely connected to the external lead, thus forming a thin partin the wire; next ascending the capillaryand the thin partto substantially the same height as a first bonding point A, then moving the capillaryin a direction away from the first bonding point A, thus making a linear wire portionand then cutting the wire at the thin part; then connecting the end(thin part) of the linear wire portionand the wire tip endat the lower end of the capillaryare connected to the external lead; and then separating the wire tip endfrom the external lead