The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Jan. 15, 2015
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventors:
Assignee:
SHINKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 3/047 (2006.01); H05B 3/14 (2006.01); H05B 3/26 (2006.01); B23K 1/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/085 (2013.01); B23K 1/0016 (2013.01); B23K 3/047 (2013.01); H01L 24/75 (2013.01); H05B 3/141 (2013.01); H05B 3/26 (2013.01); B23K 2101/42 (2018.08); H01L 2224/75502 (2013.01);
Abstract
Provided is a plate-like heater for a bonding apparatus () including: a lower surface () to which a bonding tool () is attached; and an upper surface () to which a heat insulator () is attached. The upper surface () is provided with a large number of capillary slits (), and the large number of capillary slits () and a matching surface () of the heat insulator () attached to the upper surface () form a large number of capillary coolant flow-paths () each extending from a cavity () to a lateral surface (). This allows effective cooling of the heater for a bonding apparatus.