Tokyo, Japan

Yasuhiro Chida

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Yasuhiro Chida: Innovator in Bonding Technology

Introduction

Yasuhiro Chida is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative designs and methods.

Latest Patents

Chida holds a patent for a "Heater for bonding apparatus and method of cooling the same." This invention features a plate-like heater that includes a lower surface for attaching a bonding tool and an upper surface equipped with a heat insulator. The upper surface is designed with numerous capillary slits, which, in conjunction with the heat insulator, create multiple coolant flow-paths. This design allows for effective cooling of the heater, enhancing the performance of bonding apparatuses.

Career Highlights

Yasuhiro Chida is associated with Shinkawa Ltd., a company known for its advancements in bonding technology. His work has been instrumental in improving the efficiency and effectiveness of bonding processes in various applications.

Collaborations

Chida has collaborated with notable colleagues, including Kohei Seyama and Osamu Kakutani. Their combined expertise has contributed to the development of innovative solutions in the bonding technology sector.

Conclusion

Yasuhiro Chida's contributions to bonding technology through his patent and work at Shinkawa Ltd. highlight his role as an influential inventor in the field. His innovative designs continue to impact the industry positively.

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