Shinkawa Ltd.

Yasuhiro Chida

Kohei Seyama

Osamu Kakutani

Provided is a plate-like heater for a bonding apparatus () including: a lower surface () to which a bonding tool () is attached; and an upper surface () to which a heat insulator () is attached. The upper surface () is provided with a large number of capillary slits (), and the large number of capillary slits () and a matching surface () of the heat insulator () attached to the upper surface () form a large number of capillary coolant flow-paths () each extending from a cavity () to a lateral surface (). This allows effective cooling of the heater for a bonding apparatus.

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Tokyo, Japan

Yasuhiro Chida