The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Dec. 09, 2016
Applicant:

Shinkawa Ltd., Tokyo, JP;

Inventors:

Shigeru Hayata, Tokyo, JP;

Hiroya Yuzawa, Tokyo, JP;

Hiromi Tomiyama, Tokyo, JP;

Assignee:

SHINKAWA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01); H01L 21/67 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0016 (2013.01); B23K 3/08 (2013.01); H01L 21/52 (2013.01); H01L 21/67138 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); B23K 2101/40 (2018.08); H01L 24/45 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78753 (2013.01); H01L 2224/78804 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85121 (2013.01); H01L 2924/00014 (2013.01);
Abstract

A bonding apparatushaving a diagonal optical system, the bonding apparatus moves a capillarydown to a first heightwise position to calculate a position A11 of a tip end portion of the capillaryand a position A12 of a tip end portion of the capillary in an image on an imaging plane of the diagonal optical system, and similarly moves the capillarydown to a further lower second heightwise position to calculate a position A21 of the tip end portion of the capillaryand a position A22 of the tip end portion of the capillary in the image on the imaging plane. The bonding apparatus then estimates the position of the landing point of the capillaryon a bonding targetbased on positional data for the four calculated positions A11, A12, A21, and A22, the first heightwise position, and the second heightwise position. With this, it is possible to use the diagonal optical system in the bonding apparatus to further improve positional accuracy in the bonding process.


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