The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jun. 26, 2017
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventors:
Assignee:
SHINIKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 37/00 (2006.01); B23K 20/00 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); B23K 37/04 (2006.01);
U.S. Cl.
CPC ...
B23K 20/002 (2013.01); B23K 20/005 (2013.01); B23K 37/04 (2013.01); H01L 23/544 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 2224/78 (2013.01);
Abstract
Provided is a bonding apparatus including a bonding stagefor heating a substrate (lead frame)placed on the upper surface thereof or a semiconductor diemounted on the substrate (lead frame), an imaging devicearranged above the bonding stageto image the substrateplaced on the bonding stageor the semiconductor diemounted on the substrate, and a standing wave generating devicefor generating an ultrasonic standing wave in the space between the upper surface of the bonding stageand the imaging device. This improves the accuracy of image position detection by the imaging device with a simple structure.