Company Filing History:
Years Active: 2018
Title: Yusuke Matsuki - Innovator in Bonding Technology
Introduction
Yusuke Matsuki is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative patent.
Latest Patents
Matsuki holds a patent for a mounting apparatus that includes a bonding stage for heating a substrate, such as a lead frame, or a semiconductor die mounted on the substrate. The apparatus features an imaging device positioned above the bonding stage to capture images of the substrate or semiconductor die. Additionally, it incorporates a standing wave generating device that produces an ultrasonic standing wave in the space between the bonding stage and the imaging device. This design enhances the accuracy of image position detection while maintaining a simple structure.
Career Highlights
Yusuke Matsuki is associated with Shinikawa Ltd., where he applies his expertise in bonding technology. His work has been instrumental in advancing the capabilities of bonding apparatuses, making them more efficient and effective.
Collaborations
Matsuki collaborates with talented individuals such as Shigeru Hayata and Hiroya Yuzawa, contributing to the innovative environment at Shinikawa Ltd.
Conclusion
Yusuke Matsuki's contributions to bonding technology through his patent demonstrate his commitment to innovation and excellence in his field. His work continues to influence advancements in the industry.