The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Oct. 21, 2021
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventors:
Toshihiko Toyama, Tokyo, JP;
Yuu Hasegawa, Tokyo, JP;
Assignee:
SHINKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67138 (2013.01); B23K 20/004 (2013.01); B23K 20/005 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01);
Abstract
Provided is a wire tension adjuster () that adjusts tension (T) applied to a wire () of a wire bonding apparatus (). In the wire tension adjuster (), in a state in which the wire () is gripped by a wire clamper (), air is supplied to a wire tensioner () and a height position (H) of a tip () of a bonding arm () is detected, and a flow rate (G) of the air supplied to the wire tensioner () is adjusted based on the height position (H) detected, thereby adjusting the tension (T) applied to the wire ().