The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Nov. 12, 2020
Shinkawa Ltd., Tokyo, JP;
Kohei Seyama, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A semiconductor device manufacturing device () comprises: a stage () on which a substrate () is loaded; a bonding head () that is disposed facing the stage () and that bonds a semiconductor chip () to the substrate (); and a controller (). The bonding head () includes: an attachment () that holds the semiconductor chip () by suctioning; and a heating part () that detachably holds the attachment () and that heats the attachment (). The heating part () has a first heating area () and a second heating area () that surrounds the first heating area () in the horizontal direction. The controller () controls the temperatures of the first heating area () and the second heating area () independently.