Yoshihito Hagiwara

Title: **Yoshihito Hagiwara: A Pioneering Innovator in Semiconductor Bonding**

Introduction

Yoshihito Hagiwara, an esteemed inventor based in Tokyo, Japan, has made substantial contributions to the field of semiconductor technology. With a portfolio of eight patents, his innovations focus primarily on improving bonding techniques and materials used in semiconductor manufacturing.

Latest Patents

Among his latest innovations are two significant patents:

1. **PTFE Sheet and Method for Mounting Die**: This patent presents a PTFE sheet featuring PTFE fibers with a diameter of 1 µm or less, characterized by a Gurley value ranging from 1 s/100 cc to 3 s/100 cc. The sheet exhibits a maximum shrinkage factor of 10% when heated to 300°C. This innovation allows for effective vacuum adsorption of semiconductor dies during mounting, ensuring stability and improving maintainability by reducing adhesion to both the tool and die surfaces.

2. **Bonding Apparatus and Bonding Method**: This invention provides a bonding apparatus that utilizes thermocompression to bond a semiconductor die to a substrate via an adhesive material. The apparatus comprises a bonding tool with a dedicated bonding surface, a pair of first tape constraining surfaces, and a control part to manage the movements of these components. These features enhance precision during the bonding process and contribute to greater efficiency in semiconductor manufacturing.

Career Highlights

Yoshihito Hagiwara has had a distinguished career, having worked with notable companies such as Shinkawa Ltd. and Valqua Ltd. His work at these firms has allowed him to refine his expertise and develop innovative solutions in the semiconductor sector.

Collaborations

Throughout his career, Hagiwara has collaborated with professionals like Tomonori Nakamura and Osamu Watanabe. Their joint efforts have further propelled advancements in bonding technology, demonstrating the importance of teamwork in driving innovation.

Conclusion

Yoshihito Hagiwara’s contributions to the invention of bonding technologies and materials in the semiconductor space have marked him as a key innovator. With his latest patents showcasing cutting-edge advancements, he continues to play an influential role in shaping the future of semiconductor manufacturing. His work not only reflects his ingenuity but also underscores the essence of collaboration in pioneering efforts within the industry.