Shinkawa Ltd.

Valqua, Ltd.

Yoshihito Hagiwara

Tomonori Nakamura

Osamu Watanabe

Naoki Sekine

Yuji Kanai

Koichi Takahashi

Yasuo Nagashima

Hiroshi Horibe

Kazumasa Sasakura

Nobuo Takahashi

Motoki Nakazawa

Yuu Hasegawa

Tatsuyuki Sunada

A PTFE sheet in which PTFE fibers having a diameter of 1 &#x3bc;m or less are spun, the PTFE sheet having a Gurley value in the range of 1 s/100 cc/into 3 s/100 cc/inand a shrinkage factor in a direction orthogonal to a sheet winding direction of no more than 10% when heated to 300&#xb0; C. The PTFE sheet makes a die adsorbable via a tool, which is for heating the die when the die is mounted on a mounting body, by being sandwiched between the die and the tool, and suppresses the adhesion, to an adsorption surface of the tool or to the die, of an adhesion member for fixing the die to the mounted body. Through this configuration, a PTFE sheet capable of stabilizing vacuum adsorption and improving maintainability and a method for mounting a die are provided.

PTFE sheet and method for mounting die

A bonding apparatus and a bonding method are provided. The bonding apparatus bonds a semiconductor die to a substrate by thermocompression through an adhesive material. This bonding apparatus is provided with: a bonding tool which has a bonding surface that holds the semiconductor die through a first portion of a tape, and a pair of first tape constraining surfaces that are arranged so as to sandwich the bonding surface and constrain a second portion of the tape: tape constraining mechanisms which have a second tape constraining surface that presses the tape against the first tape constraining surfaces; and a control part which controls the movements of the bonding tool and the tape constraining mechanisms.

Bonding apparatus and bonding method

A method of mounting a die includes: preparing a die having a bump formation surface on which a plurality of bump electrodes are formed; disposing a vacuum suction tool having a suction surface above the die such that the suction surface faces toward the bump formation surface; sandwiching a porous sheet between the suction surface and the bump formation surface and suctioning the die by the vacuum suction tool; and mounting the die that has been suctioned by the vacuum suction tool in a bonding region of a substrate with an adhesive material interposed therebetween, the porous sheet having a thickness equal to or greater than the protrusion height of the bump electrodes on the bump formation surface. Stabilization and ease of maintenance of vacuum suction can thereby be improved.

Method of mounting die

The mounting apparatus includes: a bonding headthat bonds, while pressing, a semiconductor chiponto a substrateor another semiconductor chip; and a heating mechanismthat heats the semiconductor chipfrom the side during the execution of this bonding. After two or more semiconductor chipsare stacked while being bonded by temporary pressure-bonding, the bonding headheats and applies pressure to an upper surface of the resultant stacked body, thereby integrally pressure-bonding the two or more semiconductor chips, and at the time of this pressure-bonding the heating mechanismheats the stacked body from the side.

Semiconductor chip mounting apparatus and semiconductor chip mounting method

The disclosure includes: a first lifting step for bonding a wire at a first position () with a capillary and for lifting the capillary up to a first height Hwhile feeding the wire; a circular arc lifting step for carrying out a circular arc motion for moving the capillary in a circular arc toward a second position () by a first distance (L), and then carrying out a lifting motion for lifting the capillary while feeding the wire; a circular arc motion step for moving the capillary in a circular arc toward the first position () by a second distance (L+L); a second lifting step for lifting the capillary up to a second height H; and a looping step for looping the capillary to the second position (), thereby forming a wire loop having a predetermined height on a substrate by bonding the wire at the second position ().

Manufacturing method of semiconductor device

A ball forming devicefor forming a ballat a tip of a wireby producing discharge between a torch electrodeand the tip of the wire, the device includes: a current supply unitconfigured to supply a ball-forming current between the torch electrodeand the tip of the wire; and a current control unitconfigured to control the current supply unit, so that a signal of the ball-forming current for a predetermined period includes a first period in which the signal takes a predetermined current value and a second period including a triangle wave. With this, it is possible to provide a ball forming device, a wire-bonding apparatus, and a ball formation method that are capable of suppressing formation of deformed balls.

Ball forming device, wire-bonding apparatus, and ball formation method

A method of manufacturing a semiconductor device is provided. A bonding tool with a wire tail extending out of the tip thereof is lowered to bring the tip of the wire tail into contact with a bonding surface of the semiconductor device. Next, the bonding tool in a direction intersecting with the axial direction of the bonding tool (Z direction) is moved to bend the wire tail with the tip of the wire tail in contact with the bonding surface. Then the bonding tool is lowered to form the wire tail into a predetermined shape such that the tip of the wire tail points upward. And then, a wire looping step, a second bonding step and a wire cutting step are performed. This allows the wire tail to be formed easily and efficiently into a predetermined shape.

Method for producing semiconductor device, and wire-bonding apparatus

Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.

Growing community of inventors

Tokyo, Japan

Yoshihito Hagiwara