The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Nov. 25, 2020
Shinkawa Ltd., Tokyo, JP;
Hiroaki Yoshino, Tokyo, JP;
Shinsuke Tei, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
The semiconductor device manufacturing method includes a bonding step of bonding a wire to an electrode (), a looping wire formation step of looping the wire from the electrode () to a dummy electrode () to form a looping wire (), a pressing step of pressing a part of the wire, a moving step of moving the pressed part of the wire directly above the electrode, a wire separation step of separating the wire partially from a wire supply to form a pin wire () extending vertically upward from the electrode (), wherein the looping wire formation step adjusts the looping height of the wire to set the length of the looping wire to a predetermined length.