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For the Inventor, By the Inventor

Mitaka, Japan

Toru Maeda

This inventor holds 60 USPTO granted patents and 6 published patent applications and 3 EPO patents, primarily in Semiconductor Bonding (CPC class H01L). Top assignees: Canon Kabushiki Kaisha, Shinkawa Ltd., Nihon Kohden Corporation. Active years: 1987-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toru Maeda. Retrieved from https://idiyas.com/inventor/toru-maeda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 60 

% Patents Active = 76.7

 

Average Co-Inventor Count = 2.2

ph-index = 13

Forward Citations = 786(Granted Patents)

Forward Citations (Not Self Cited) = 776(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Yokohama, JP (1987 - 1996)
  • Tachikawa, JP (2004 - 2009)
  • Mitaka, JP (1995 - 2015)
  • Tokyo, JP (1995 - 2024)

Company Filing History:

goldMedal34 out of 92,994 
 
Canon Kabushiki Kaisha
 patents
silverMedal17 out of 136 
 
Shinkawa Ltd.
 patents
bronzeMedal4 out of 578 
 
Nihon Kohden Corporation
 patents
4. 3 out of 349 
 
Kabushiki Kaisha Shinkawa
 patents
5. 2 out of 42,731 
 
Hitachi, Ltd.
 patents
6. 2 out of 1,051 
 
Tohoku University
 patents
7. 1 out of 447 
 
Ulvac, Inc.
 patents
where one patent can have more than one assignee

Years Active: 1987-2024

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Areas of Expertise:
Bonding Apparatus
Mounting Device
Semiconductor Chip
Manufacturing Method
Alignment Method
Non-Conductive Film
Thermal Management
Data Backup
Image Communication
Biological Sensor
Facsimile Communication
Plasma Ignition
60 patents (USPTO):Explore Patents
1. 12080679 - Bonding apparatus and alignment method (2024-09-03),
2. 11545462 - Mounting apparatus and mounting system (2023-01-03),
3. 11296048 - Semiconductor chip mounting device and method for manufacturing semiconductor device (2022-04-05),
4. 11201132 - Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus (2021-12-14),
5. 11172600 - Mounting device (2021-11-09),
6. 11094567 - Mounting apparatus and method for manufacturing semiconductor device (2021-08-17),
7. 11024596 - Bonding apparatus and bonding method (2021-06-01),
8. 10896901 - Method of manufacturing semiconductor device, and mounting device (2021-01-19),
9. 10847434 - Method of manufacturing semiconductor device, and mounting apparatus (2020-11-24),
10. 9575855 - Storage apparatus and failure location identifying method (2017-02-21),
11. 9415456 - Antioxidant gas blow-off unit (2016-08-16),
12. 9362251 - Antioxidant gas blow-off unit (2016-06-07),
13. 9201601 - Reducing required battery capacity for data backup in a storage system with multiple controllers (2015-12-01),
14. 9123096 - Information processing apparatus and control method thereof (2015-09-01),
15. 9044821 - Antioxidant gas supply unit (2015-06-02),

Title: Toru Maeda: Pioneering Inventor from Mitaka

Introduction: Toru Maeda is a distinguished inventor hailing from Mitaka, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Toru Maeda holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Toru Maeda has worked with leading tech companies in Japan, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Toru Maeda has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge-sharing.

Conclusion: Toru Maeda's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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