The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
May. 29, 2018
Shinkawa Ltd., Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A mounting apparatus for manufacturing a semiconductor device by bonding a semiconductor chip () to a mounted object that is a substrate () or another semiconductor chip () is provided. The mounting apparatus includes: a stage () on which the substrate () is placed, a mounting head () that is capable of moving relative to the stage () and bonds the semiconductor chip () to the mounted object, and an irradiation unit (that irradiates, from a lower side of the stage (), an electromagnetic wave transmitting through the stage and heating the substrate (). The stage () has a first layer () formed on an upper surface side, and the first layer () has a greater thermal resistance in a plane direction than the thermal resistance in a thickness direction.