The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Sep. 19, 2018
Shinkawa Ltd., Tokyo, JP;
Tomonori Nakamura, Tokyo, JP;
Toru Maeda, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A semiconductor mounting device for mounting chip components on a substrate, wherein the device is reduced in size. A semiconductor mounting devicecomprises: a temporary placement stageon which are loaded a plurality of chip components; a conveyance headthat conveys the chip componentsto the temporary placement stage, and also loads each of the chip componentson the temporary placement stageso that the relative positions of the plurality of chip componentsreach predetermined positions; a mounting stagethat secures a substrateby suction; and a mounting headthat suctions the plurality of chip componentsloaded on the temporary placement stage, and pressurizes while keeping the relative positions at prescribed positions on the substratethat is secured by suction to the mounting stage