Canon Kabushiki Kaisha

Shinkawa Ltd.

Nihon Kohden Corporation

Kabushiki Kaisha Shinkawa

Hitachi, Ltd.

Tohoku University

Ulvac, Inc.

Toru Maeda

Hitoshi Saito

Kazuhiro Sugawara

Tomonori Nakamura

Masanori Momose

Akira Matsui

Shinichiro Kohri

Makoto Kobayashi

Naomi Nakamura

Yasushi Morimoto

Satoshi Imai

Toru Fujino

Akemi Sato

Takehiro Yoshida

Toshio Kenmochi

Seiji Ohmori

Hiroyuki Yaguchi

Osamu Watanabe

Teiji Ukawa

Akinobu Teramoto

Motoaki Yoshino

Kotaro Yamaguchi

Tomohiro Akiba

Kazutaka Matsueda

Kenzou Sekiguchi

Noriaki Todokoro

Mitsuaki Sakakura

Naoji Hayakawa

Tetsuya Utano

Satoru Nagai

Hideki Shimizu

Yoshio Yoshiura

Kenji Aiyama

Ritsushi Tanabe

Ryosuke Matsubara

Kazuto Yanagisawa

Fumiyuki Takiguchi

Keiichi Sugiura

Masashi Kimura

Shigeki Ohno

Koichiro Ohtsuka

Takaaki Hashimoto

Kiyohide Satoh

Hiroki Kanai

Kazuhiro Miyasa

Fumio Shoji

Yoshihiro Saeki

Masatomo Takahashi

Kaori Nakagawa

Hideki Fujisaki

Yukio Nohata

Naoki Sugawara

Hideo Ozawa

Sadasuke Kurahayashi

Yuichiro Noguchi

Osamu Kakutani

Iwao Takahashi

Tetsuo Takano

Kenzo Sekiguchi

Masaaki Oda

Kazuo Fujita

Yoshinobu Nakae

Shinichiro Kori

Tomomi Murozono

Jun'ichi Takahira

Masanori Hamajima

Tetsuro Tanikawa

A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.

Bonding apparatus and alignment method

A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

Mounting apparatus and mounting system

Provided is a mounting device in which two or more semiconductor chips are laminated and mounted at a plurality of locations on a substrate, said mounting device including: a stage that supports the substrate; a bonding part that laminates and mounts the plurality of semiconductor chips on the substrate while heating the plurality of semiconductor chips and the substrate; and a heat insulating member that is interposed between the stage and the substrate, said heat insulating member including a first layer which is in contact with the substrate and to which heat is applied from the bonding part via the semiconductor chips and the substrate, and a second layer which is disposed closer to the stage side than the first layer, wherein the first layer has a larger heat resistance than the second layer.

Semiconductor chip mounting device and method for manufacturing semiconductor device

Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.

Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus

A semiconductor mounting device for mounting chip components on a substrate, wherein the device is reduced in size. A semiconductor mounting devicecomprises: a temporary placement stageon which are loaded a plurality of chip components; a conveyance headthat conveys the chip componentsto the temporary placement stage, and also loads each of the chip componentson the temporary placement stageso that the relative positions of the plurality of chip componentsreach predetermined positions; a mounting stagethat secures a substrateby suction; and a mounting headthat suctions the plurality of chip componentsloaded on the temporary placement stage, and pressurizes while keeping the relative positions at prescribed positions on the substratethat is secured by suction to the mounting stage

Mounting device

A mounting apparatus for manufacturing a semiconductor device by bonding a semiconductor chip () to a mounted object that is a substrate () or another semiconductor chip () is provided. The mounting apparatus includes: a stage () on which the substrate () is placed, a mounting head () that is capable of moving relative to the stage () and bonds the semiconductor chip () to the mounted object, and an irradiation unit (that irradiates, from a lower side of the stage (), an electromagnetic wave transmitting through the stage and heating the substrate (). The stage () has a first layer () formed on an upper surface side, and the first layer () has a greater thermal resistance in a plane direction than the thermal resistance in a thickness direction.

Mounting apparatus and method for manufacturing semiconductor device

[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding devicefor thermally bonding an electronic componentto a substrateor to another electronic component via an adhesive material, the bonding device being provided with: a bonding toolcomprising a bonding distal-end portionwhich includes a bonding surfaceand tapered side surfacesformed in a tapering shape becoming narrower toward the bonding surface, the bonding surfacehaving a first suction holefor suction-attaching the electronic componentvia an individual piece of a porous sheet, the tapered side surfaceshaving second suction holesfor suction-attaching the porous sheet; and a bonding control unitwhich controls the first suction holeand the second suction holesindependently from each other.

Bonding apparatus and bonding method

The disclosure is provided with: a temporary crimping step in which one or more semiconductor chipsare sequentially laminated while being temporarily crimped in each of two or more locations on a substrateto thereby form chip stacks ST in a temporarily crimped state; and a permanent crimping step in which the top surfaces of all of the chip stacks ST formed in the temporarily crimped state are sequentially heated, pressurized, and permanently crimped. Furthermore, a specifying step is provided prior to the temporary crimping step for specifying a separation distance Dd which is the distance from the chip stacks ST under permanent crimping to a location at which the temperature of the substrate, the temperature having been raised by heating for the permanent crimping, becomes less than or equal to a prescribed permissible temperature Td, and in the temporary crimping step, the chip stacks ST in the temporarily crimped state are formed separated from each other by the separation distance Dd or more.

Method of manufacturing semiconductor device, and mounting device

A method of manufacturing a semiconductor device in which a prescribed target lamination number of semiconductor chips are laminated on a substrate, the method includes: a first lamination step of laminating while temporarily bonding one or more semiconductor chips on the substrate to thereby form a first chip laminate body; a first permanent bonding step of pressurizing while heating from the upper side of the first chip laminate body to thereby collectively and permanently bond the one or more semiconductor chips; a second lamination step of sequentially laminating while temporarily bonding two or more semiconductor chips on the permanently bonded semiconductor chips to thereby form a second chip laminate body; and a second permanent bonding step of pressurizing while heating from the upper side of the second chip laminate body to thereby collectively permanently bond the two or more semiconductor chips.

Method of manufacturing semiconductor device, and mounting apparatus

A storage apparatus has a redundant configuration equipped with a plurality of components and includes a first controller and second controller, wherein the first controller is provided with a first processor and a third processor for monitoring the first controller; wherein the second controller is provided with a second processor and a fourth processor for monitoring the second controller; wherein the first processor and the second processor are connected via a first path and the third processor and the fourth processor are connected via a second path; and wherein if a failure occurs at the first controller, the second processor blocks the first path, acquires failure information including a failure location of the first controller via the third processor, the fourth processor, and the second path, executes first failure location identifying processing, and notifies a management terminal of the failure location.

Storage apparatus and failure location identifying method

An antioxidant gas blow-off unit comprises a plate-shaped hollow base portion with an antioxidant gas flow passage formed therein, a hole provided in the base portion so as to allow a capillary to be inserted thereinto or removed therefrom and configured to communicate with the antioxidant gas flow passage, and a plurality of electrodes embedded in a wall of the base portion in the vicinity of the hole and configured to generate plasma from an antioxidant gas. With the antioxidant gas blow-off unit, the bonding quality of a wire bonding apparatus can be improved.

Antioxidant gas blow-off unit

An antioxidant gas blow-off unit includes: a base portion configured as a hollow plate having an antioxidant gas flow passage formed therein; a hole that is provided in the base portion to allow a capillary to be inserted therein or removed therefrom and that communicates with the antioxidant gas flow passage; and a heater mounted on an outer surface of the base portion. The antioxidant gas flow passage includes a first flow passage provided in the vicinity of the outer surface of the base portion on which the heater is mounted. This antioxidant gas blow-off unit to be installed in a wire bonding apparatus heats free air balls effectively with a compact structure.

A storage system which is connected to a host computer, includes a storage device; a first controller which controls data transfers between the storage device and the host computer; a second controller connected to the first controller and controls data transfers between the storage device and the host computer; a non-volatile memory; and a battery device. The first controller includes a first volatile memory and the second controller comprising a second volatile memory. Upon a power outage, the battery device starts supplying electric power to the first controller and the second controller, and wherein the second controller copies data which is stored in the first volatile memory to the second volatile memory and, after copying is complete, stops operation of the first controller, stops the power supply from the battery device to the first controller, and copies data.

Reducing required battery capacity for data backup in a storage system with multiple controllers

In an information processing apparatus, an ROI acquisition unit acquires a position of an ROI in an object. A position/orientation acquisition unit acquires a position and orientation of a tomographic image acquired by an ultrasonic probe. A processing-target region acquisition unit acquires a processing-target region defined based on the position of the ROI. A calculation unit calculates a cross area between the processing-target region and the tomographic image based on the position and orientation of the tomographic image. A display control unit displays the tomographic image and an outline image indicating an approximate outline of a portion to be examined, and also displays information indicating the cross region on the outline image.

Information processing apparatus and control method thereof

Provided is an antioxidant gas supply unit including: a base body () in a shape of a hollow plate having antioxidant gas flow paths () and () defined therein; an antioxidation gas inlet () for letting an antioxidant gas flow into the antioxidant gas flow paths () and (); a through hole () penetrating through the base body () in a through-thickness direction so that a capillary () is allowed to be inserted into and removed from the hole, and communicating with the antioxidant gas flow paths () and () to let the antioxidant gas flow out; and a film heater () attached to an outer surface of the base body () around the through hole (). The antioxidant gas supply unit has a compact structure and is capable of effectively heating a free air ball.

Antioxidant gas supply unit

Growing community of inventors

Mitaka, Japan

Toru Maeda