The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Nov. 29, 2017
Shinkawa Ltd., Tokyo, JP;
Osamu Watanabe, Tokyo, JP;
Tomonori Nakamura, Tokyo, JP;
Toru Maeda, Tokyo, JP;
Satoru Nagai, Tokyo, JP;
Yuichiro Noguchi, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding devicefor thermally bonding an electronic componentto a substrateor to another electronic component via an adhesive material, the bonding device being provided with: a bonding toolcomprising a bonding distal-end portionwhich includes a bonding surfaceand tapered side surfacesformed in a tapering shape becoming narrower toward the bonding surface, the bonding surfacehaving a first suction holefor suction-attaching the electronic componentvia an individual piece of a porous sheet, the tapered side surfaceshaving second suction holesfor suction-attaching the porous sheet; and a bonding control unitwhich controls the first suction holeand the second suction holesindependently from each other.