The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Apr. 13, 2020
Applicant:

Shinkawa Ltd., Tokyo, JP;

Inventors:

Jin Li, Tokyo, JP;

Hiroshi Kikuchi, Tokyo, JP;

Satoshi Enokido, Tokyo, JP;

Assignee:

SHINKAWA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/677 (2013.01);
Abstract

This conveying devicecomprises: a chuckthat contactlessly holds a semiconductor chipto face a holding surfaceB; and a guidethat has a guide probecapable of abutting a chip side surfaceof the semiconductor chip, and for the semiconductor chipheld by the chuck, the guide probelimits the movement of the semiconductor chipin the lateral direction which intersects a normal N to the holding surfaceB. The guide probeis capable of reciprocating movement in which a probe tipmoves towards and away from the holding surfaceB.


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