The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Dec. 13, 2021
Shinkawa Ltd., Tokyo, JP;
Kohei Seyama, Tokyo, JP;
Takahiro Shimizu, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A manufacturing apparatus () for manufacturing a semiconductor device includes: a wafer holding device (), a PU device () having a PU head () that holds a target chip () in a non-contact manner, an energy irradiation device () irradiating energy to the target chip () from a back surface side of a dicing tape () to reduce an adhesive force of the dicing tape (), and a controller (). An adhesive layer of the dicing tape () is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip () by a small distance. The controller () controls a position of the PU head () so that the target chip () and the PU head () do not come into contact with each other even if the target chip () floats during a takeoff preparation period.