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For the Inventor, By the Inventor

Tokyo, Japan

Yamaha Motor Robotics Holdings Co., Ltd.


USPTO Granted Patents = 1

Forward Citations = 0

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2 inventors (with patents filed for the assignee):

goldMedal Kohei Seyama (1 out of 36 patents)

silverMedal Yuichiro Noguchi (1 out of 10 patents)


1 patent:

1. 11393700 - Bonding apparatus and bonding method (2022-07-19),
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USPTO Data Jan 1 1976 - Dec 30 2025

1 Patents

#5,730 in Tokyo

#15,542 in Japan

...
Tokyo, Japan

Yamaha Motor Robotics Holdings Co., Ltd.

Forward Citations = 0

2 inventors:

goldMedal Kohei Seyama (1 out of 36 patents)

silverMedal Yuichiro Noguchi (1 out of 10 patents)

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