The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jul. 12, 2018
Applicant:
Yamaha Motor Robotics Holdings Co., Ltd., Tokyo, JP;
Inventors:
Kohei Seyama, Tokyo, JP;
Yuichiro Noguchi, Tokyo, JP;
Assignee:
Yamaha Motor Robotics Holdings Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); B23K 3/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); B23K 3/00 (2013.01); H01L 24/75 (2013.01); H01L 2021/60195 (2013.01); H01L 2224/83203 (2013.01);
Abstract
This bonding apparatus is provided with: a bonding mechanism which has a bonding surface that holds a semiconductor die in a detachable manner, with a film being interposed therebetween, and a heater that applies heat to the bonding surface; a film conveyance mechanism which supplies the film to the bonding surface; a remover bar which is able to enter between the film and the bonding surface; and a drive unit which drives the remover bar.