The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Apr. 08, 2020
Applicant:

Shinkawa Ltd., Tokyo, JP;

Inventors:

Kohei Seyama, Tokyo, JP;

Tetsuya Utano, Tokyo, JP;

Assignee:

SHINKAWA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H05K 13/046 (2013.01); H05K 13/0409 (2018.08); H01L 24/73 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75745 (2013.01);
Abstract

A mounting apparatus for mounting a semiconductor chip on a mounting body includes a stage on which the mounting body is placed, a mounting head provided to be movable up and down above the stage and pressing the semiconductor chip against the mounting body, and a film disposition mechanism which interposes a belt-like cover film between the mounting head and the stage, and the film disposition mechanism includes a film feeding part having a feeding reel around which at least the cover film has been wound, a film recovery part having a recovery reel also winding up at least the fed cover film, and one or more relay shafts provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film.


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