The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Aug. 05, 2020
Applicant:
Yamaha Robotics Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Yamaha Robotics Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/603 (2006.01); H01L 21/52 (2006.01); H01L 21/60 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/603 (2021.08); H01L 21/52 (2013.01); H01L 24/08 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 2021/6015 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75 (2013.01);
Abstract
In this mounting device () for mounting a semiconductor chip () on a substrate (), a controller () is provided with: a mounter for pressing the semiconductor chip () to the substrate () in a state where a cover film () is interposed between the semiconductor chip () and a thermocompression tool (), and for heating and then cooling the thermocompression tool () to mount the semiconductor chip () on the substrate (); and a separator for heating the thermocompression tool () after the semiconductor chip () has been mounted, and for raising a mounting head () to be separated from the cover film ().