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Yamaha Robotics Co., Ltd.

USPTO Granted Patents = 22

Forward Citations = 0

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23 inventors (with patents filed for the assignee):

Kohei Seyama (7 out of 43 patents)

Makoto Takahashi (5 out of 122 patents)

Masaaki Miyatake (2 out of 2 patents)

4. Hayato Hishinuma (2 out of 2 patents)

5. Hiroshi Kikuchi (2 out of 2 patents)

6. Yuichiro Noguchi (1 out of 11 patents)

7. Osamu Kakutani (1 out of 2 patents)

8. Takuya Adachi (1 out of 20 patents)

9. Yuji Eguchi (1 out of 4 patents)

10. Kiyotaka Tanaka (1 out of 3 patents)

11. Hiroshi Munakata (1 out of 9 patents)

12. Masahiko Fujisawa (1 out of 9 patents)

13. Tsutomu Kiyono (1 out of 2 patents)

14. Katsutoshi Nomura (1 out of 2 patents)

15. Alexander Dzhangirov (1 out of 4 patents)

22 patents: Sort by Forward Citations

1. 12733455 - Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium (2026-09-08),

2. 12732053 - Three-phase coil structure and linear motor (2026-09-08),

3. 12729075 - Conveyance device, conveyance method, and non-transitory computer readable medium (2026-09-08),

4. D1144248 - Vibration plate for non-contact handling jig (2026-08-25),

5. D1140877 - Vibration plate for non-contact handling jig (2026-08-11),

6. 12702037 - Bonding apparatus, bonding method, and computer readable storage medium (2026-08-04),

7. 12700174 - Three-dimensional image generation device and three-dimensional image generation method (2026-08-04),

8. 12697688 - Semiconductor device manufacturing apparatus and manufacturing method (2026-08-04),

9. 12673451 - Resin-sealing method (2026-07-07),

10. 12666915 - Mounting apparatus, mounting method, and recording medium (2026-06-23),

11. 12661831 - Resin sealing apparatus and sealing mold (2026-06-23),

12. 12643268 - Compression molding device (2026-06-02),

13. 12638830 - Position control apparatus, position control method, position control recording medium, and bonding apparatus (2026-05-26),

14. 12635549 - Bump-forming device, bump-forming method, and non-transitory computer-readable medium (2026-05-19),

15. 12616049 - Wire bonding device, maintenance method and non-transitory computer-readable recording medium recording program (2026-04-28),

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

22 Patents

#1,283 in Tokyo

#2,789 in Japan

#28,704 in the World

Yamaha Robotics Co., Ltd.

Forward Citations = 0

23 inventors:

Kohei Seyama (7 out of 43 patents)

Makoto Takahashi (5 out of 122 patents)

Masaaki Miyatake (2 out of 2 patents)

4. Hayato Hishinuma (2 out of 2 patents)

5. Hiroshi Kikuchi (2 out of 2 patents)

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