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Yamaha Robotics Co., Ltd.

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USPTO Granted Patents = 25

Forward Citations = 0

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26 inventors (with patents filed for the assignee):

Kohei Seyama (7 out of 43 patents)

Makoto Takahashi (5 out of 125 patents)

Takuya Adachi (2 out of 21 patents)

4. Masaaki Miyatake (2 out of 2 patents)

5. Hayato Hishinuma (2 out of 2 patents)

6. Hiroshi Kikuchi (2 out of 2 patents)

7. Yuichiro Noguchi (1 out of 11 patents)

8. Osamu Kakutani (1 out of 2 patents)

9. Yuji Eguchi (1 out of 4 patents)

10. Kiyotaka Tanaka (1 out of 3 patents)

11. Hiroshi Munakata (1 out of 9 patents)

12. Masahiko Fujisawa (1 out of 9 patents)

13. Shigeyuki Uchiyama (1 out of 3 patents)

14. Tsutomu Kiyono (1 out of 2 patents)

15. Katsutoshi Nomura (1 out of 2 patents)

25 patents: Sort by Forward Citations

1. 12784345 - Method for generating three-dimensional diagram of object, three-dimensional diagram generation apparatus and three-dimensional shape inspection apparatus (2026-11-03),

2. 12765410 - Mounting head (2026-10-13),

3. 12746711 - Compression molding device and compression molding method (2026-09-29),

4. 12733455 - Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium (2026-09-08),

5. 12732053 - Three-phase coil structure and linear motor (2026-09-08),

6. 12729075 - Conveyance device, conveyance method, and non-transitory computer readable medium (2026-09-08),

7. D1144248 - Vibration plate for non-contact handling jig (2026-08-25),

8. D1140877 - Vibration plate for non-contact handling jig (2026-08-11),

9. 12702037 - Bonding apparatus, bonding method, and computer readable storage medium (2026-08-04),

10. 12700174 - Three-dimensional image generation device and three-dimensional image generation method (2026-08-04),

11. 12697688 - Semiconductor device manufacturing apparatus and manufacturing method (2026-08-04),

12. 12673451 - Resin-sealing method (2026-07-07),

13. 12666915 - Mounting apparatus, mounting method, and recording medium (2026-06-23),

14. 12661831 - Resin sealing apparatus and sealing mold (2026-06-23),

15. 12643268 - Compression molding device (2026-06-02),

Company Overview

Yamaha Robotics Co., Ltd., based in Tokyo, specializes in the development and manufacturing of advanced robotic systems and automation solutions. The company focuses on enhancing productivity and efficiency across various industries, including manufacturing, logistics, and healthcare. With a commitment to innovation, Yamaha Robotics integrates cutting-edge technologies such as artificial intelligence and machine learning into its products, aiming to provide versatile and reliable robotic solutions that meet the evolving needs of global markets.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 10 2026

25 Patents

#1,196 in Tokyo

#2,573 in Japan

#25,794 in the World

Yamaha Robotics Co., Ltd.

Forward Citations = 0

26 inventors:

Kohei Seyama (7 out of 43 patents)

Makoto Takahashi (5 out of 125 patents)

Takuya Adachi (2 out of 21 patents)

4. Masaaki Miyatake (2 out of 2 patents)

5. Hayato Hishinuma (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Yamaha Robotics Co., Ltd.. Retrieved from https://idiyas.com/company/yamaha-robotics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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