The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Mar. 22, 2022
Yamaha Robotics Co., Ltd., Tokyo, JP;
Shigeyuki Uchiyama, Nagano, JP;
Yamaha Robotics Co., Ltd., Tokyo, JP;
Abstract
The present invention addresses the problem of providing a compression molding device and a compression molding method capable of preventing deformation of electronic components and the like, mounted on a substrate, due to positional displacement of resin during transport, and capable of preventing variation in molding quality. As a solution to this problem, a compression molding device () according to the present invention uses a sealing die () provided with an upper die () and a lower die () to seal, by means of block-shaped resin (R), a substrate (Wa) on which an electronic component (Wb) is mounted, to process the same into a molded article, wherein the compression molding device is provided with a resin welding mechanism () for welding the resin (R) to a predetermined position on the substrate (Wa).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile