The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Feb. 15, 2022
Applicant:

Yamaha Robotics Co., Ltd., Tokyo, JP;

Inventor:

Makoto Takahashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 74/20 (2026.01); H05K 1/02 (2006.01); H05K 3/303 (2026.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01); H10P 72/00 (2026.01); H10P 72/50 (2026.01); H10P 74/00 (2026.01); H10W 72/00 (2026.01); H10W 95/00 (2026.01);
U.S. Cl.
CPC ...
H10P 74/203 (2026.01); H05K 1/0269 (2013.01); H05K 3/303 (2013.01); H05K 13/0015 (2013.01); H05K 13/04 (2013.01); H05K 13/0812 (2018.08); H05K 13/0815 (2018.08); H10P 72/00 (2026.01); H10P 72/0606 (2026.01); H10P 72/50 (2026.01); H10P 74/277 (2026.01); H10W 72/071 (2026.01); H10W 95/00 (2026.01); H05K 2203/166 (2013.01);
Abstract

An inspection device includes: a measurement part, measuring a reference position of a mounting section before mounting of a semiconductor chip, a reference position of a plurality of peripheral sections located around the mounting section, and a position of the semiconductor chip after mounting; and an inspection part, inspecting a relative position of the semiconductor chip with respect to the mounting section based on a distance between the reference position of the mounting section and the reference position of the plurality of peripheral sections measured by the measurement part and a distance between the reference position of the plurality of peripheral sections and a mounting position of the semiconductor chip after mounting of the semiconductor chip.


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