Shinkawa Ltd.

Tohoku University

Yamaha Motor Robotics Holdings Co., Ltd.

Kohei Seyama

Tetsuya Utano

Yuichiro Noguchi

Akira Sato

Osamu Kakutani

Yuji Eguchi

Shoji Wada

Nobuyuki Aoyagi

Hiroshi Kikuchi

Takehito Shimatsu

Tomonori Nakamura

Hijiri Hayashi

Takahiro Shimizu

Shigeru Hayata

Miyuki Uomoto

Takatoshi Kawamura

Shigeyuki Sekiguchi

Yutaka Kondo

Alexander Dzhangirov

Yasuhiro Chida

Manato Nishide

A bonding system () is provided with a bonding device () for bonding semiconductor chips () to individual substrates (), and a substrate holder () for holding the individual substrates (), the bonding device () being provided with a stage () for fixing, by suction, the substrate holder () on a placement surface (), the substrate holder () being provided with a plate-shaped base () and a positioning member () that is provided on the base () and that defines the position of the individual substrates (), the base () having an upper surface () on which the individual substrates () are placed and a lower surface () that is fixed by suction onto the placement surface ().

Substrate holder and bonding system

A mounting deviceis equipped with: two direct-acting voice coil motorsin which a movable elementreciprocatingly moves along an axis A relative to a fixed element; and a colletA mounted on an end part side of the movable elements, the colletA holding a semiconductor chipby suction. The plurality of voice coil motorsare disposed so as to be set away from each other along a direction intersecting the axes A, and in a manner that the axes A are parallel to each other. The colletA is mounted so as to straddle chucksprovided at the end parts of the two movable elements

Mounting device

The present invention provides a mounting apparatus, including a bonding stage holding a substrate on which a semiconductor chip is arranged; a base stand; a mounting head mounted with a pressing tool that presses the semiconductor chip on the substrate; and a film arranging mechanism provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip pressed by the substrate and the pressing tool. The film arranging mechanism includes film guides guiding the cover film and defining a height with respect to the bonding stage; and lifting mechanisms connected to the film guides via springs and lifting and lowering the film guides with respect to the bonding stage.

Mounting apparatus

A semiconductor device manufacturing device () comprises: a stage () on which a substrate () is loaded; a bonding head () that is disposed facing the stage () and that bonds a semiconductor chip () to the substrate (); and a controller (). The bonding head () includes: an attachment () that holds the semiconductor chip () by suctioning; and a heating part () that detachably holds the attachment () and that heats the attachment (). The heating part () has a first heating area () and a second heating area () that surrounds the first heating area () in the horizontal direction. The controller () controls the temperatures of the first heating area () and the second heating area () independently.

Semiconductor device manufacturing device and manufacturing method

A manufacturing apparatus () for manufacturing a semiconductor device includes: a wafer holding device (), a PU device () having a PU head () that holds a target chip () in a non-contact manner, an energy irradiation device () irradiating energy to the target chip () from a back surface side of a dicing tape () to reduce an adhesive force of the dicing tape (), and a controller (). An adhesive layer of the dicing tape () is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip () by a small distance. The controller () controls a position of the PU head () so that the target chip () and the PU head () do not come into contact with each other even if the target chip () floats during a takeoff preparation period.

Manufacturing apparatus of semiconductor device

An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.

Arrangement apparatus and arrangement method

A mounting apparatus for mounting a semiconductor chip on a mounting body includes a stage on which the mounting body is placed, a mounting head provided to be movable up and down above the stage and pressing the semiconductor chip against the mounting body, and a film disposition mechanism which interposes a belt-like cover film between the mounting head and the stage, and the film disposition mechanism includes a film feeding part having a feeding reel around which at least the cover film has been wound, a film recovery part having a recovery reel also winding up at least the fed cover film, and one or more relay shafts provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film.

This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

Bonding apparatus

A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.

This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

Method for producing structure, and structure

The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip () to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.

Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips

A wiring structure () includes: a fixed member (); a movable member () which moves rectilinearly with respect to the fixed member (); a wire material () which connects the movable member () and the fixed member (); a movable guide () over which the wire material () is stretched and which can move rectilinearly with respect to the fixed member (); and a movement mechanism () which causes the movable guide () to move, in conjunction with the rectilinear movement of the movable member (), rectilinearly in a direction in which the loosening or tightening of the wire material () caused by the rectilinear movement of the movable member () is offset.

Wiring structure with movement mechanism

A device for linearly moving bases with respect to an object, includes first and second bases, a linear scale provided with graduations at pitches in the moving direction, first and second encoder heads attached to the first and second bases, and a control unit. The control unit maintains an interval between the first and second encoder heads to be constant, and moves the first and second bases while sequentially detects a first and second graduation numbers, and calculates a distance on the scale between the first and second encoder heads by multiplying a difference between the first and second graduation numbers by the pitch, and calculates a position correction coefficient of the scale as a ratio of the interval with respect to the calculated distance, and controls the movement amount of the first movable body and the second movable body based on the position correction coefficient.

Device and method for linearly moving first and second moving bodies relative to target object

The present invention is provided with: a base moving linearly relative to a substrate and having a first and second positions that are spaced apart from each other by a predetermined interval a in the movement direction; a linear scale where a plurality of graduations having a predetermined pitch are provided along the movement direction; encoder heads which respectively are disposed at the first and second positions of the base and detect first and second graduation numbers of the linear scale with respect to the first and second positions, wherein, as the base is moved along the linear scale, the first and second graduation numbers are detected in this order in the respective encoder heads, and the movement amount of the base is controlled on the basis of the ratio between the predetermined interval and the distance between the first graduation number and the second graduation number on the scale.

Apparatus and method for linearly moving movable body relative to object

A bonding apparatus includes a bonding stage on which either a rectangular substrate or a circular substrate can be installed; a first transport mechanism which transports the rectangular substrate from a first carry-in unit to the bonding stage and from the bonding stage to a first carry-out unit; and a second transport mechanism which transports the circular substrate from a second carry-in/out unit to the bonding stage and from the bonding stage to the second carry-in/out unit, in which a first transport path determined by the first transport mechanism and a second transport path determined by the second transport mechanism partially overlap.

Growing community of inventors

Tokyo, Japan

Kohei Seyama