Armonk, NY, United States of America

Hosadurga K Shobha

This inventor holds 114 USPTO granted patents and 28 published patent applications, primarily in Semiconductor Interconnects (CPC class H01L23-5226). Top assignees: International Business Machines Corporation, Adeia Semiconductor Bonding Technologies Inc., Globalfoundries Inc.. Active years: 2005-2026.

USPTO Granted Patents = 114 

% Patents Active = 58.8

Average Co-Inventor Count = 5.3

ph-index = 11

Forward Citations = 430(Granted Patents)

Forward Citations (Not Self Cited) = 349(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Yorktown Heights, NY (US) (2005 - 2010)
  • Albany, NY (US) (2012 - 2016)
  • Armonk, NY (US) (2020 - 2021)
  • Niskayuana, NY (US) (2022)
  • Niskayuna, NY (US) (2010 - 2023)

Company Filing History:


Years Active: 2005-2026

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Areas of Expertise:
Interconnects
Dielectric Deposition
Power Delivery
Microcooler Designs
Hybrid Structures
Backside Engineering
Via Integration
Metallization
Copper Structures
Trapezoidal Interconnects
High Aspect Ratio
Void-Free Structures
114 patents (USPTO):Explore Patents

Title: Hosadurga K Shobha: Innovator in Semiconductor Technology

Introduction: Hosadurga K Shobha, based in Armonk, NY, is a prominent inventor known for his significant contributions in the field of semiconductor technology. With an impressive portfolio of 97 patents, he has made substantial strides in innovative solutions that improve electronic components.

Latest Patents: Shobha's recent patents showcase his expertise in creating advanced interconnect structures. One of his notable inventions, titled "Bottom barrier free interconnects without voids," introduces an interconnect structure with metal lines embedded in a dielectric. This structure is characterized by the absence of a barrier layer between interconnects and metal lines, enhancing connectivity and performance. Additionally, his patent on "Top via patterning using metal as hard mask and via conductor" involves a semiconductor structure that integrates layers of metal and dielectric, providing a refined approach to via design in semiconductor fabrication.

Career Highlights: Throughout his career, Hosadurga K Shobha has worked with leading companies in the semiconductor industry, including IBM and Globalfoundries Inc. His work has not only advanced technology but also contributed to enhancing the capabilities of electronic devices globally.

Collaborations: Shobha has collaborated with esteemed colleagues such as Son Van Nguyen and Deepika Priyadarshini, which reflects his commitment to teamwork and the sharing of innovative ideas within the industry.

Conclusion: Hosadurga K Shobha stands out as a key figure in semiconductor innovations, with a wealth of patents that demonstrate his technical prowess and forward-thinking approach. His contributions are instrumental in shaping the future of electronic technology.

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