The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

May. 11, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Hosadurga Shobha, Niskayuna, NY (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Huai Huang, Clifton Park, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H10D 30/67 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 21/76897 (2013.01); H01L 23/5226 (2013.01); H10D 30/6757 (2025.01); H10D 84/0149 (2025.01); H10D 84/038 (2025.01); H10D 62/121 (2025.01);
Abstract

Embodiments disclosed herein include a semiconductor structure. The semiconductor structure may include a first power plane electrically connected to a first plurality of via-to-backside power planes (VBPPs), a second power plane, and a plurality of pass through vias electrically connecting the second power plane to a second plurality of VBPPs, wherein the plurality of pass through vias pass through the first power plane.


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