The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Dec. 27, 2021
International Business Machines Corporation, Armonk, NY (US);
Sagarika Mukesh, Albany, NY (US);
Fee Li Lie, Albany, NY (US);
Hosadurga Shobha, Shobha, NY (US);
Devika Sarkar Grant, Rensselaer, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
One or more systems, devices and/or methods provided herein relate to a circuit device having a modular or selectively designed interconnect structure with a plurality of conformal features. In the semiconductor realm, such achievements can allow for fabrication of a device with sub 18 nanometer (nm) or lesser pitch between adjacent and/or parallel lines of the interconnect structure. A device can comprise a semiconductor device having an interconnect structure having a first set of parallel lines and a second set of parallel lines, where the lines of the first set can be arranged in a transverse direction to the lines of the second set. The lines of the first set can be disposed orthogonally to the lines of the second set. The first second sets of lines can comprise first and second rounded jogs that are conformal to one another and which connect the first set of lines to the second set of lines.