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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hong-Chen Cheng

USPTO Granted Patents = 49 

Average Co-Inventor Count = 4.6

ph-index = 4

Forward Citations = 85(Granted Patents)


Company Filing History:

goldMedal49 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 98 
 
TSMC Nanjing Company, Limited
 patents
where one patent can have more than one assignee

Years Active: 2009-2025

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Areas of Expertise:
Integrated Circuit
Memory Macro
Through-Silicon Via
Semiconductor Device
Inter-Layer Via
Sense Amplifier
Voltage Providing Circuit
Memory Cell Array
Dual Rail SRAM
Resistive Memory
Multi-Power Domain Design
Word-Line Driver
49 patents (USPTO):Explore Patents
1. 12308303 - Integrated circuit die with memory macro including through-silicon via and method of forming the same (2025-05-20),
2. 11854943 - Memory macro including through-silicon via (2023-12-26),
3. 11723195 - Semiconductor device having an inter-layer via (ILV), and method of making same (2023-08-08),
4. 11562946 - Memory macro including through-silicon via (2023-01-24),
5. 11138359 - Method of fabricating a semiconductor device (2021-10-05),
6. 11024634 - Semiconductor device having an inter-layer via (ILV), and method of making same (2021-06-01),
7. 10866281 - System and method to diagnose integrated circuit (2020-12-15),
8. 10762269 - Method of fabricating a semiconductor device (2020-09-01),
9. 10339248 - Modified design rules to improve device performance (2019-07-02),
10. 10267853 - System and method to diagnose integrated circuit (2019-04-23),
11. 10170487 - Device having an inter-layer via (ILV), and method of making same (2019-01-01),
12. 10049706 - Memory and method of operating the same (2018-08-14),
13. 10001801 - Voltage providing circuit (2018-06-19),
14. 9852249 - Modified design rules to improve device performance (2017-12-26),
15. 9685226 - Tracking signals in memory write or read operation (2017-06-20),

Title: Hong-Chen Cheng: A Trailblazer in Innovation

Introduction:

Hong-Chen Cheng, based in Hsinchu, Taiwan, is a visionary inventor who has etched his name in the annals of innovation with his dedication to progress and his commitment to shaping a brighter tomorrow through his inventive designs.

Latest Patents:

Among his 48 patents, two of his latest innovations include a cutting-edge memory macro featuring through-silicon via technology, revolutionizing integrated circuits by enhancing connectivity and power distribution. Additionally, his semiconductor device boasting an inter-layer via showcases his prowess in semiconductor technology, offering efficient memory device connectivity through intricate design.

Career Highlights:

Having worked with giants like Taiwan Semiconductor Manufacturing Company Ltd. and TSMC Nanjing Company Limited, Hong-Chen Cheng has honed his skills and expertise in the semiconductor industry, contributing significantly to technological advancements and breakthroughs in the field.

Collaborations:

Throughout his career, Hong-Chen Cheng has collaborated with industry experts and innovators like Cheng Hung Lee and Hung-Jen Liao, leveraging collective knowledge and experience to drive innovation and push the boundaries of what is possible in the realm of semiconductors.

Conclusion:

In conclusion, Hong-Chen Cheng stands as a beacon of inspiration in the world of innovation, embodying the spirit of relentless pursuit and unwavering passion for crafting a better future through his inventive creations. His contributions to the field of semiconductor technology are testament to his ingenuity and dedication, leaving an indelible mark on the landscape of innovation.

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