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For the Inventor, By the Inventor

Watervliet, NY, United States of America

Eric Miller

This inventor holds 19 USPTO granted patents and 17 published patent applications and 1 EPO patent. Top assignee: International Business Machines Corporation. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eric Miller. Retrieved from https://idiyas.com/inventor/eric-miller-5yop5n4u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.7

ph-index = 1


Company Filing History:

goldMedal19 out of 166,351 
 
International Business Machines Corporation
 patents

Years Active: 2024-2026

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19 patents (USPTO):Explore Patents
1. 12720853 - Placeholder with dielectric liner protection to prevent direct backside contact (DBC) from shorting to gate (2026-08-25),
2. 12677443 - Self-aligned substrate isolation (SASI) of gate-all-around nanosheet field effect transistors (2026-07-07),
3. 12648179 - Co-integration of source-drain trench metal cut and gate-contact-over active device for advanced transistor architectures (2026-06-02),
4. 12628638 - Buried via-to-backside power rail (VBPR) for stacked field-effect transistor (FET) (2026-05-12),
5. 12628410 - Non-shared metal gate integration for scaled gate all around (GAA) transistors (2026-05-12),
6. 12615816 - Flexible self-aligned power via shape with gate cut first (2026-04-28),
7. 12575399 - Interconnect structure including vertically stacked power and ground lines (2026-03-10),
8. 12471355 - Non-overlapping gate conductors for GAA transistors (2025-11-11),
9. 12406930 - Structure containing a via-to-buried power rail contact structure or a via-to-backside power rail contact structure (2025-09-02),
10. 12363965 - Stacked transistor layout for improved cell height scaling (2025-07-15),
11. 12341099 - Semiconductor backside transistor integration with backside power delivery network (2025-06-24),
12. 12327798 - Physical unclonable function (2025-06-10),
13. 12324207 - Channel protection of gate-all-around devices for performance optimization (2025-06-03),
14. 12107132 - Source/drain contact positioning under power rail (2024-10-01),
15. 12080559 - Using a same mask for direct print and self-aligned double patterning of nanosheets (2024-09-03),

Title: The Innovative Journey of Eric Miller

Introduction: Eric Miller, a talented inventor hailing from Watervliet, NY, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Eric Miller's latest patents include a cutting-edge virtual reality device that has revolutionized the gaming industry, as well as a patented smart home system that enhances convenience and security for homeowners.

Career Highlights: With a career spanning over two decades, Eric Miller has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has garnered recognition for its creativity and practicality.

Collaborations: Throughout his career, Eric Miller has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work effectively in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking products.

Conclusion: Eric Miller's passion for innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a pioneering inventor in the field. His contributions continue to inspire the next generation of inventors to think outside the box and create solutions that shape the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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