The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Apr. 09, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kangguo Cheng, Schenectady, NY (US);

Eric Miller, Watervliet, NY (US);

Fee Li Lie, Albany, NY (US);

Gauri Karve, Cohoes, NY (US);

Marc A. Bergendahl, Rensselaer, NY (US);

John Ryan Sporre, Albany, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); G06F 21/75 (2013.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G06F 21/75 (2013.01); H10D 84/0142 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01); H10D 84/834 (2025.01); H01L 2223/54413 (2013.01); H01L 2223/5444 (2013.01);
Abstract

Methods, and devices related to authentication of chips using physical unclonable function (PUF) are disclosed. The semiconductor chip has a substrate having a major surface. The semiconductor chip has a boundary defined on the major surface in accordance with a ground rule associated with a gate cut passing (CT) fin formed on the major surface. The semiconductor chip has multiple non-planar devices fabricated on the surface at the boundary. The CT fin forms a random distribution of field effect transistors (FETs) with varying work function metal (WFM) thickness that includes some FETs that fail the ground rule and other FETs that meet the ground rule. A physical unclonable function (PUF) region is defined in accordance with the random distribution.


Find Patent Forward Citations

Loading…