Meridian, ID, United States of America

Er-Xuan Ping

This inventor holds 177 USPTO granted patents and 5 published patent applications and 3 EPO patents, primarily in Semiconductor Processing (CPC class H01L2-18242). Top assignees: Micron Technology Incorporated, Applied Materials, Inc., Sandisk 3D LLC. Active years: 1998-2025.

USPTO Granted Patents = 177 

% Patents Active = 53.1

 

Average Co-Inventor Count = 2.4

ph-index = 19

Forward Citations = 1,844(Granted Patents)

Forward Citations (Not Self Cited) = 1,723(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Meridan, ID (US) (2004)
  • Manassas, VA (US) (2006 - 2009)
  • Boise, ID (US) (1998 - 2011)
  • Meridian, ID (US) (2000 - 2017)
  • Fremont, CA (US) (2009 - 2023)

Company Filing History:


Years Active: 1998-2025

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Areas of Expertise:
Silicon Carbide
3D NAND
Carbon-Based Materials
Epitaxial Growth
Memory Density
Vertical Transistor
Dielectric Films
Cobalt Deposition
Microfeature Processing
Resistivity Switching
Capacitor Structures
Nanodots
177 patents (USPTO):Explore Patents

Title: Er-Xuan Ping: Pioneering Innovator in Semiconductor Devices

Introduction:

Meet Er-Xuan Ping, a prolific inventor based in Meridian, ID. With an impressive portfolio of 176 patents under his name, Ping has made significant contributions to the field of semiconductor devices. His groundbreaking work in fabricating memory devices and developing innovative methods for 3D structure fill has revolutionized the industry. In this article, we delve into Ping's latest patents, career highlights, notable collaborations, and showcase the impact of his remarkable achievements.

Latest Patents:

Ping's recent patents showcase his expertise in semiconductor fabrication processes and memory technology. Notably, his patent titled "Multi-layer stacks for 3D NAND extendability" describes methods and materials for fabricating memory devices. By selectively removing one material in the memory layer stack, an airgap is formed, enhancing the device's structure. Additionally, Ping's patent on "Method and system for three-dimensional (3D) structure fill" presents a novel technique involving directional plasma treatment and optimized deposition rates to fill trenches in wafers effectively.

Career Highlights:

Ping's career has thrived at renowned companies in the semiconductor industry, where his innovative contributions have been recognized and appreciated. He has worked at Micron Technology Incorporated and Sandisk 3D LLC, two industry giants renowned for their groundbreaking advancements.

Collaborations:

Throughout his career, Ping has had the privilege of collaborating with exceptional individuals who share his passion for innovation. Notable coworkers include Lingyi A Zheng and Trung Tri Doan, both esteemed professionals in the field of semiconductor devices. Their collective expertise has undoubtedly fueled the success of numerous projects and contributed to the advancement of the industry as a whole.

Conclusion:

Er-Xuan Ping's relentless pursuit of excellence in the field of semiconductor devices has resulted in an impressive array of patents that have significantly impacted the industry. His groundbreaking work in fabricating memory devices and developing innovative methods for 3D structure fill has revolutionized the way we approach semiconductor technology. Ping's career highlights and collaborations further exemplify his dedication to fostering innovation and driving technological progress. As the world of technology continues to evolve, Er-Xuan Ping remains a driving force in shaping the future of semiconductor devices and inspiring generations of inventors to push the boundaries of what is possible.

References:

- Publicly available information on Er-Xuan Ping's patents and collaboration

- Official websites and profiles of Micron Technology Incorporated and Sandisk 3D LLC

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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