The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Jan. 26, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sungwon Jun, San Jose, CA (US);

Saurabh Chopra, Santa Clara, CA (US);

Thomas Jongwan Kwon, Dublin, CA (US);

Er-Xuan Ping, Fremont, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); C23C 16/06 (2006.01); H01L 29/423 (2006.01); C23C 16/04 (2006.01); C23C 16/24 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/452 (2006.01); C23C 16/50 (2006.01); C30B 25/18 (2006.01); C30B 29/52 (2006.01); C30B 29/60 (2006.01); H01L 27/11556 (2017.01);
U.S. Cl.
CPC ...
H01L 21/02601 (2013.01); C23C 16/04 (2013.01); C23C 16/06 (2013.01); C23C 16/24 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/452 (2013.01); C23C 16/50 (2013.01); C30B 25/183 (2013.01); C30B 29/52 (2013.01); C30B 29/60 (2013.01); H01L 21/0262 (2013.01); H01L 21/02488 (2013.01); H01L 21/02507 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/02639 (2013.01); H01L 21/28273 (2013.01); H01L 29/42332 (2013.01); H01L 27/11556 (2013.01);
Abstract

A method of forming a 3D NAND structure having self-aligned nanodots includes depositing alternating layers of an oxide and a nitride on a substrate; at least partially recessing the nitride layers; and forming SiGe nanodots on the nitride layers. A method of forming a 3D NAND structure having self-aligned nanodots includes depositing alternating layers of an oxide and a nitride on a substrate; at least partially recessing the nitride layers; and forming SiGe nanodots on the nitride layers by a process including maintaining a temperature of the substrate below about 560° C.; flowing a silicon epitaxy precursor into the chamber; forming a silicon epitaxial layer on the substrate at the nitride layers; flowing germanium gas into the chamber with the silicon epitaxy precursor; and forming a silicon germanium epitaxial layer on the substrate at the nitride layers.


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