The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Jun. 19, 2015
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Minrui Yu, Sunnyvale, CA (US);
Kai Ma, Palo Alto, CA (US);
Thomas Kwon, Dublin, CA (US);
Kaushal K. Singh, Santa Clara, CA (US);
Er-Xuan Ping, Fremont, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); C23C 28/00 (2006.01); H01L 21/768 (2006.01); C23C 14/06 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53266 (2013.01); C23C 28/322 (2013.01); C23C 28/34 (2013.01); C23C 28/345 (2013.01); H01L 21/76838 (2013.01); C23C 14/0641 (2013.01); C23C 16/401 (2013.01);
Abstract
The present disclosure provides a film stack structure formed on a substrate and methods for forming the film stack structure on the substrate. In one embodiment, the method for forming a film stack structure on a substrate includes depositing a first adhesion layer on an oxide layer formed on the substrate and depositing a metal layer on the first adhesion layer, wherein the first adhesion layer and the metal layer form a stress neutral structure.