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For the Inventor, By the Inventor

Gansevoort, NY, United States of America

Craig Child

This inventor holds 16 USPTO granted patents and 2 published patent applications, primarily in Integrated Circuit Design. Top assignees: Globalfoundries Inc., Globalfoundries U.S. Inc., Advanced Micro Devices Corporation. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Craig Child. Retrieved from https://idiyas.com/inventor/craig-child

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 81.3

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 44(Granted Patents)


Location History:

  • Hopewell Junction, NY (US) (2011 - 2014)
  • Wilton, NY (US) (2016 - 2017)
  • Gansevoort, NY (US) (2015 - 2022)

Company Filing History:

goldMedal12 out of 5,671 
 
Globalfoundries Inc.
 patents
silverMedal3 out of 1,093 
 
Globalfoundries U.S. Inc.
 patents
bronzeMedal1 out of 13,185 
 
Advanced Micro Devices Corporation
 patents
4. 1 out of 1,064 
 
Globalfoundries Singapore Pte. Ltd.
 patents
5. 1 out of 244 
 
Infineon Technologies North America Corp.
 patents
6. 1 out of 166,425 
 
International Business Machines Corporation
 patents
7. 1 out of 63 
 
Toshiba America Electronic Components, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2011-2025

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Areas of Expertise:
Vertical Memory Devices
Multiple Patterning
Via Structures
Oblique Angle Deposition
Chamferless Vias
BEOL Integration
Interconnect Formation
Magnetic Tunnel Junctions
Magnetoresistive RAM
Air Gap Technology
Dual Damascene Structures
Integrated Circuits
16 patents (USPTO):Explore Patents
1. 12453102 - Vertical memory devices (2025-10-21),
2. 11417525 - Multiple patterning with mandrel cuts defined by block masks (2022-08-16),
3. 11367750 - Vertical memory devices (2022-06-21),
4. 10643891 - Via structures and via patterning using oblique angle deposition processes (2020-05-05),
5. 10566231 - Interconnect formation with chamferless via, and related interconnect (2020-02-18),
6. 10340177 - Devices and methods of reducing damage during BEOL M1 integration (2019-07-02),
7. 10181420 - Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias (2019-01-15),
8. 9818623 - Method of forming a pattern for interconnection lines and associated continuity blocks in an integrated circuit (2017-11-14),
9. 9812396 - Interconnect structure for semiconductor devices with multiple power rails and redundancy (2017-11-07),
10. 9786545 - Method of forming ANA regions in an integrated circuit (2017-10-10),
11. 9691971 - Integrated circuits including magnetic tunnel junctions for magnetoresistive random-access memory and methods for fabricating the same (2017-06-27),
12. 9431294 - Methods of producing integrated circuits with an air gap (2016-08-30),
13. 9165770 - Methods for fabricating integrated circuits using improved masks (2015-10-20),
14. 8822342 - Method to reduce depth delta between dense and wide features in dual damascene structures (2014-09-02),
15. 8513109 - Method of manufacturing an interconnect structure for a semiconductor device (2013-08-20),

Title: The Innovative Contributions of Craig Child

Introduction

Craig Child is a prominent inventor based in Gansevoort, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His work focuses on advanced methods and structures that enhance the performance and efficiency of memory devices.

Latest Patents

Among his latest patents is a method for multiple patterning with mandrel cuts defined by block masks. This innovative approach involves depositing a hardmask over an interlayer dielectric layer, forming a mandrel, and creating a block mask that selectively exposes sections of the mandrel. The process allows for the definition of a pattern that includes mandrel lines, which are then transferred to the hardmask and subsequently to the interlayer dielectric layer through etching processes. Another notable patent relates to vertical memory devices, which includes structures with multiple bit cells and common electrodes, showcasing his expertise in semiconductor manufacturing.

Career Highlights

Craig Child has worked with notable companies in the semiconductor industry, including GlobalFoundries Inc. and GlobalFoundries U.S. Inc. His experience in these organizations has allowed him to contribute to cutting-edge technologies and innovations in memory devices.

Collaborations

Throughout his career, Craig has collaborated with talented individuals such as Guillaume Bouche and Jason Eugene Stephens. These partnerships have fostered an environment of innovation and creativity, leading to advancements in semiconductor technology.

Conclusion

Craig Child's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the development of advanced memory devices and manufacturing methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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