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Irvine, CA, United States of America

Toshiba America Electronic Components, Inc.

USPTO Granted Patents = 63

Trademarks = 1

Forward Citations = 356

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75 inventors (with patents filed for the assignee):

Masao Kaizuka (8 out of 8 patents)

Rakesh Sethi (7 out of 19 patents)

Gaku Sudo (6 out of 26 patents)

4. Luverne Ray Peterson (5 out of 22 patents)

5. David William Boerstler (4 out of 142 patents)

6. Yusuke Kohyama (4 out of 75 patents)

7. Kazuhiko Miki (3 out of 20 patents)

8. Yoshiaki Shimooka (3 out of 25 patents)

9. Tadashi Iijima (3 out of 3 patents)

10. John M Lo (3 out of 9 patents)

11. Takeshi Nogami (2 out of 191 patents)

12. Jieming Qi (2 out of 76 patents)

13. Osamu Takahashi (2 out of 58 patents)

14. Eskinder Hailu (2 out of 72 patents)

15. Kazumichi Tsumura (2 out of 17 patents)

Core Competencies:

Optically Isolated Sensing

Biometric Mapping

Semiconductor Memory

Low Power Design

Digital Output Sensors

Interconnect Structures

Stent Imaging Apparatus

Temperature Sensing

Charge Pump

Spread Spectrum Clock Generators

Dual Stress Liner Devices

Video Coder Control

63 patents: Sort by Forward Citations

1. 10520548 - System and method for optically isolated current or voltage sensing (2019-12-31),

2. 9380226 - System and method for extraction of a dynamic range zone image (2016-06-28),

3. 9379892 - Trusted manager bridge (2016-06-28),

4. 9313418 - Method and apparatus for detection of biological conditions (2016-04-12),

5. 9295423 - System and method for audio kymographic diagnostics (2016-03-29),

6. 9220462 - Imaging sensor and method for biometric mapping of facial skin (2015-12-29),

7. 9220413 - Stent apparatus with integrated imaging element for in situ detection of buildup of material in a vascular system (2015-12-29),

8. 9208864 - Semiconductor memory with integrated biologic element (2015-12-08),

9. 8822342 - Method to reduce depth delta between dense and wide features in dual damascene structures (2014-09-02),

10. 8772942 - Interconnect structure employing a Mn-group VIIIB alloy liner (2014-07-08),

11. 8716134 - Interconnect structure employing a Mn-group VIIIB alloy liner (2014-05-06),

12. 8656429 - System and method for displaying and navigating a graphical two-dimensional array of a plurality of available channels (2014-02-18),

13. 8598006 - Strain preserving ion implantation methods (2013-12-03),

14. 8596864 - Digital output temperature sensor and method of temperature sensing (2013-12-03),

15. 8536018 - Maskless inter-well deep trench isolation structure and methods of manufacture (2013-09-17),

Toshiba America Electronic Components, Inc. (TAEC) is the American subsidiary of Toshiba Electronic Devices and Storage Corporation, a global leader in advanced storage technologies and electronic components. TAEC offers a comprehensive range of innovative semiconductor and storage solutions for various applications, including automotive, industrial, consumer electronics, and more. With a focus on quality, reliability, and technological advancements, TAEC is committed to delivering cutting-edge products and providing excellent customer support and service.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

63 Patents

#55 in Irvine, CA

#1,313 in California

#5,576 in US

#11,331 in the World

Irvine, CA, United States of America

Toshiba America Electronic Components, Inc.

Forward Citations = 356

75 inventors:

Masao Kaizuka (8 out of 8 patents)

Rakesh Sethi (7 out of 19 patents)

Gaku Sudo (6 out of 26 patents)

4. Luverne Ray Peterson (5 out of 22 patents)

5. David William Boerstler (4 out of 142 patents)

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