Tokyo, Japan

Akira Sugawara

USPTO Granted Patents = 84 

 

Average Co-Inventor Count = 3.2

ph-index = 19

Forward Citations = 1,175(Granted Patents)

DiyaCoin DiyaCoin 1.38 


Inventors with similar research interests:


Location History:

  • Hachioji, JP (1989 - 1994)
  • Atsugi-shi, Kanagawa-ken JP (1997)
  • Toyooka-mura, JP (2000 - 2002)
  • Kanagawa, JP (1995 - 2005)
  • Iwata-gun, JP (2003 - 2005)
  • Chiba, JP (2008)
  • Atsugi, JP (1989 - 2012)
  • Iwata, JP (2011 - 2015)
  • Yokohama, JP (2012 - 2015)
  • Shizuoka, JP (2001 - 2019)
  • Kawasaki, JP (2012 - 2021)
  • Tokyo, JP (1995 - 2024)

Company Filing History:


Years Active: 1989-2025

where 'Filed Patents' based on already Granted Patents

84 patents (USPTO):

Title: Akira Sugawara: Innovator in Copper Alloys and Heat Radiation Technology

Introduction

Akira Sugawara is a prominent inventor based in Tokyo, Japan, renowned for his significant contributions to materials science, particularly in the fields of copper alloys and heat radiation technologies. With an impressive portfolio of 80 patents, Sugawara has established himself as a key figure in innovative engineering solutions that benefit various industries.

Latest Patents

Among his recent inventions, Sugawara has developed a Cu—Ni—Si-based copper alloy sheet material that exhibits improved etching characteristics. This alloy composition includes nickel (1.00 to 4.50%), silicon (0.10 to 1.40%), and optional elements such as cobalt, magnesium, chromium, phosphorus, boron, manganese, tin, titanium, zirconium, aluminum, iron, zinc, and silver. The innovative sheet material is engineered to have a specific area ratio in EBSD measurements, enhancing its performance in various applications.

Additionally, Sugawara has introduced a method for producing a heat radiation member characterized by high durability, crucial for semiconductor elements in power modules. This member features a laminated structure that pairs metal and carbon materials, designed to retain thermal conductivity even under rigorous heat cycles. It can withstand pressurization with nitrogen gas while maintaining optimal gas permeability.

Career Highlights

Sugawara has held vital roles in esteemed companies such as Semiconductor Energy Laboratory Co., Ltd. and Dowa Metaltech Co., Ltd. His work in these organizations has been pivotal in advancing research and development in semiconductor materials and thermal management solutions. His expertise has not only been beneficial for his companies but also for the broader field of technology innovation.

Collaborations

Throughout his career, Sugawara has collaborated with notable professionals including Toshimitsu Konuma and Yukiko Uehara. These partnerships have facilitated the pooling of knowledge and expertise, leading to groundbreaking discoveries and advancements in the domain of material sciences.

Conclusion

Akira Sugawara's contributions to innovation in copper alloys and heat radiation technologies are significant and far-reaching. His extensive patent portfolio and collaborative efforts exemplify his dedication to advancing engineering and technology. As he continues to develop new solutions, Sugawara remains an influential figure in the world of inventions and patent innovations.

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