The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Aug. 29, 2016
Dowa Metaltech Co., Ltd., Tokyo, JP;
Tsuyoshi Ito, Tokyo, JP;
Kuniaki Miyagi, Tokyo, JP;
Hiroto Narieda, Tokyo, JP;
Tomotsugu Aoyama, Tokyo, JP;
Akira Sugawara, Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NOf fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mmor more and a ratio N/Nof a number density N(per 0.012 mm) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the Nof 0.50 or less.