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Dowa Metaltech Co., Ltd.

USPTO Granted Patents = 77

EPO Patents = 63

Trademarks = 2

Forward Citations = 35

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81 inventors (with patents filed for the assignee):

Akira Sugawara (27 out of 84 patents)

Hiroto Narieda (22 out of 24 patents)

Hideyo Osanai (17 out of 35 patents)

4. Hisashi Suda (13 out of 13 patents)

5. Hiroshi Miyazawa (10 out of 40 patents)

6. Weilin Gao (10 out of 10 patents)

7. Hirotaka Kotani (9 out of 9 patents)

8. Tomotsugu Aoyama (8 out of 9 patents)

9. Yuta Sonoda (8 out of 8 patents)

10. Masafumi Ogata (8 out of 11 patents)

11. Keisuke Shinohara (8 out of 9 patents)

12. Kentaro Arai (6 out of 27 patents)

13. Yutaro Hirai (5 out of 5 patents)

14. Yukiya Kato (4 out of 4 patents)

15. Satoru Ideguchi (4 out of 6 patents)

Core Competencies:

Brazing Material

Metal Ceramic Bonding

Copper Alloy Sheet

Silver Plating

Heat Radiation Component

Composite Plating

Semiconductor Module

Electronic Part Mounting

Current Carrying Component

Insulated Circuit Board

Tin Plating

77 patents: Sort by Forward Citations

1. 12497707 - Ag-plated material, method for producing Ag-plated material, and electrical component (2025-12-16),

2. 12337421 - Brazing material, method for producing the same, and method for producing metal-ceramics bonded substrate (2025-06-24),

3. 12300512 - Metal/ceramic bonding substrate and method for producing same (2025-05-13),

4. 12297556 - Silver-plated product and method for producing same (2025-05-13),

5. 12221389 - Aluminum/ceramic bonding substrate and method for producing same (2025-02-11),

6. 12203189 - Silver-plated product and method for producing same (2025-01-21),

7. 12173425 - Silver-plated product and method for producing same (2024-12-24),

8. 12145352 - Metal/ceramic bonding substrate and method for producing same (2024-11-19),

9. 12134814 - Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component (2024-11-05),

10. 12049690 - Copper alloy plate and method for producing same (2024-07-30),

11. 11946129 - Cu—Ni—Al based copper alloy sheet material, method for producing same, and conductive spring member (2024-04-02),

12. 11946127 - Cu—Ti-based copper alloy sheet material, method for producing the same, electric current carrying component, and heat radiation component (2024-04-02),

13. 11926917 - Composite plating material and method for producing the same (2024-03-12),

14. 11920255 - Composite plated product and method for producing same (2024-03-05),

15. 11919288 - Method for producing heat radiation member (2024-03-05),

DOWA METALTECH CO., LTD. is a leading company in the field of metal recycling and environmental solutions. With advanced technology and expertise, they contribute to a sustainable society by providing recycling services for various metal products. Their services include collection, sorting, processing, and refining of scrap metals to ensure their proper utilization and reduce environmental impacts. The company focuses on promoting the circular economy and recovering valuable resources from waste. Visit their website for more information on their comprehensive metal recycling solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

77 Patents

#554 in Tokyo

#1,303 in Japan

#9,505 in the World

Dowa Metaltech Co., Ltd.

Forward Citations = 35

81 inventors:

Akira Sugawara (27 out of 84 patents)

Hiroto Narieda (22 out of 24 patents)

Hideyo Osanai (17 out of 35 patents)

4. Hisashi Suda (13 out of 13 patents)

5. Hiroshi Miyazawa (10 out of 40 patents)

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