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Dowa Metaltech Co., Ltd.

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USPTO Granted Patents = 78

% Expired Patents = 1.3

EPO Patents = 63

Trademarks = 2

Forward Citations = 37

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82 inventors (with patents filed for the assignee):

Akira Sugawara (27 out of 86 patents)

Hiroto Narieda (23 out of 25 patents)

Hideyo Osanai (17 out of 35 patents)

4. Hisashi Suda (13 out of 13 patents)

5. Hiroshi Miyazawa (10 out of 40 patents)

6. Hirotaka Kotani (10 out of 10 patents)

7. Weilin Gao (10 out of 10 patents)

8. Tomotsugu Aoyama (8 out of 9 patents)

9. Yuta Sonoda (8 out of 8 patents)

10. Masafumi Ogata (8 out of 11 patents)

11. Keisuke Shinohara (8 out of 9 patents)

12. Kentaro Arai (6 out of 27 patents)

13. Yukiya Kato (5 out of 5 patents)

14. Yutaro Hirai (5 out of 5 patents)

15. Satoru Ideguchi (4 out of 6 patents)

Core Competencies:

Copper Alloy

Silver Plating

Metal-Ceramic Bonding

Composite Materials

Electrical Components

Heat Radiation

Brazing Materials

Insulated Circuit Boards

Electronic Part Mounting

Conductive Spring Members

High Strength Alloys

Partial Plating

78 patents: Sort by Forward Citations

1. 12516435 - Composite material, method for producing composite material, and terminal (2026-01-06),

2. 12497707 - Ag-plated material, method for producing Ag-plated material, and electrical component (2025-12-16),

3. 12337421 - Brazing material, method for producing the same, and method for producing metal-ceramics bonded substrate (2025-06-24),

4. 12300512 - Metal/ceramic bonding substrate and method for producing same (2025-05-13),

5. 12297556 - Silver-plated product and method for producing same (2025-05-13),

6. 12221389 - Aluminum/ceramic bonding substrate and method for producing same (2025-02-11),

7. 12203189 - Silver-plated product and method for producing same (2025-01-21),

8. 12173425 - Silver-plated product and method for producing same (2024-12-24),

9. 12145352 - Metal/ceramic bonding substrate and method for producing same (2024-11-19),

10. 12134814 - Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component (2024-11-05),

11. 12049690 - Copper alloy plate and method for producing same (2024-07-30),

12. 11946129 - Cu—Ni—Al based copper alloy sheet material, method for producing same, and conductive spring member (2024-04-02),

13. 11946127 - Cu—Ti-based copper alloy sheet material, method for producing the same, electric current carrying component, and heat radiation component (2024-04-02),

14. 11926917 - Composite plating material and method for producing the same (2024-03-12),

15. 11920255 - Composite plated product and method for producing same (2024-03-05),

Company Overview

Dowa Metaltech Co., Ltd., based in Tokyo, specializes in the development and manufacturing of advanced copper alloy materials. The company focuses on innovative technologies such as silver plating, metal-ceramic bonding, and composite materials, catering to various applications in electrical components and heat radiation. Dowa Metaltech is recognized for its expertise in brazing materials and insulated circuit boards, contributing significantly to industries that require high-performance metal solutions.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

78 Patents

#635 in Tokyo

#1,326 in Japan

#9,691 in the World

Dowa Metaltech Co., Ltd.

Forward Citations = 37

82 inventors:

Akira Sugawara (27 out of 86 patents)

Hiroto Narieda (23 out of 25 patents)

Hideyo Osanai (17 out of 35 patents)

4. Hisashi Suda (13 out of 13 patents)

5. Hiroshi Miyazawa (10 out of 40 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Dowa Metaltech Co., Ltd.. Retrieved from https://idiyas.com/company/dowa-metaltech-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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