The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Mar. 08, 2023
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Takuya Hashimoto, Tokyo, JP;

Hiroshi Yorifuji, Tokyo, JP;

Hiroshi Hyodo, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22F 1/08 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); C22F 1/08 (2013.01); Y10T 428/12431 (2015.01);
Abstract

[Object] To provide a Cu—Ti-based copper alloy sheet material having a strength, an electrical conductivity, bending workability, and a stress relaxation property all at high levels in a good balance, and also having a reduced density (specific gravity). [Means for Solution] A copper alloy sheet material composed of, in mass %, Ti: 1.0 to 5.0%, Al: 0.5 to 3.0%, Ag: 0 to 0.3%, B: 0 to 0.3%, Be: 0 to 0.15%, Co: 0 to 1.0%, Cr: 0 to 1.0%, Fe: 0 to 1.0%, Mg: 0 to 0.5%, Mn: 0 to 1.5%, Nb: 0 to 0.5%, Ni: 0 to 1.0%, P: 0 to 0.2%, Si: 0 to 0.5%, Sn: 0 to 1.5%, V: 0 to 1.0%, Zn: 0 to 2.0%, Zr: 0 to 1.0%, S: 0 to 0.2%, rare earth elements: 0 to 3.0%, and the balance substantially being Cu, wherein a maximum width of a grain boundary reaction type precipitate existing region is 1000 nm or less, a KAM value when a boundary with a crystal orientation difference of 15° or more measured by EBSD (step size: 0.1 μm) is rewarded as a crystal grain boundary is 3.0° or less, and a tensile strength in a rolling direction is 850 MPa or more.


Find Patent Forward Citations

Hashimoto, Takuya. (2024). Cu—ti-based copper alloy sheet material, method for producing the same, electric current carrying component, and heat radiation component (U.S. Patent No. 11946127). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11946127

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