The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Jul. 14, 2021
Applicant:
Dowa Metaltech Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
DOWA METALTECH CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); C25D 3/46 (2006.01); C25D 5/12 (2006.01); H01R 43/16 (2006.01); H01H 1/021 (2006.01);
U.S. Cl.
CPC ...
C25D 3/46 (2013.01); C25D 5/12 (2013.01); H01R 13/03 (2013.01); H01R 43/16 (2013.01); H01H 1/021 (2013.01);
Abstract
There is provided an Ag-plated material and a related technique, including: an Ag-plated layer on a substrate that comprises a conductive metal; and a plurality of two-layer plating structures on the substrate, the two-layer plating structures having a porous Ni-plated layer and an Ag-plated layer in this order from a substrate side.
Sato, Yosuke. (2025). Ag-plated material, method for producing ag-plated material, and electrical component (U.S. Patent No. 12497707). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12497707
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile