The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Jan. 30, 2020
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Kazuki Yoshida, Tokyo, JP;

Takanobu Sugimoto, Tokyo, JP;

Tomotsugu Aoyama, Tokyo, JP;

Hiroto Narieda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F 1/08 (2006.01); C22C 9/04 (2006.01);
U.S. Cl.
CPC ...
C22F 1/08 (2013.01); C22C 9/04 (2013.01);
Abstract

There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.


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