The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Apr. 21, 2021
Applicant:
Dowa Metaltech Co., Ltd., Tokyo, JP;
Inventors:
Yukiya Kato, Tokyo, JP;
Hirotaka Takahashi, Tokyo, JP;
Tatsuhiro Doi, Tokyo, JP;
Hirotaka Kotani, Tokyo, JP;
Takao Tomiya, Tokyo, JP;
Hiroto Narieda, Tokyo, JP;
Assignee:
DOWA METALTECH CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C25D 3/46 (2006.01); C25D 7/00 (2006.01); C25D 15/00 (2006.01);
U.S. Cl.
CPC ...
C25D 15/00 (2013.01); C25D 3/46 (2013.01); C25D 7/00 (2013.01); H01B 1/026 (2013.01);
Abstract
A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.