The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Dec. 23, 2020
Dowa Metaltech Co., Ltd., Tokyo, JP;
Wanqing Jiang, Tokyo, JP;
Hiroshi Hyodo, Tokyo, JP;
Hisashi Suda, Tokyo, JP;
Akira Sugawara, Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
A copper alloy sheet material having improved etching characteristics contains (in mass %) Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and optionally one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag. The sheet material has an area ratio S/Sof 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein Srepresents area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} <112>orientation of 10° or less or a crystal orientation difference from the S2 {231}<124>orientation of 10° or less, and Srepresents an area of a region having a crystal orientation difference from the Brass {011}<211>orientation of 10° or less.