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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12145352 B1

PDFFull Text
Date of Patent:
Nov. 19, 2024

Filed:

Feb. 10, 2020

Metal/ceramic bonding substrate and method for producing same

Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventor:

Hideyo Osanai, Tokyo, JP;

Assignee:

DOWA METALTECH CO, LTD., Tokyo, JP;

Attorney:

Bachman & LaPointe, P.C.

Primary Examiner:

Kevin P Kerns

Int. Cl.
CPC ...
B22D 19/00 (2006.01); B22D 19/02 (2006.01); B22D 19/04 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); C04B 37/02 (2006.01); C04B 41/00 (2006.01); C04B 41/45 (2006.01); C04B 41/51 (2006.01); C04B 41/88 (2006.01); H01L 23/14 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
B32B 9/041 (2013.01); B22D 19/02 (2013.01); B22D 19/04 (2013.01); B32B 9/005 (2013.01); B32B 15/20 (2013.01); C04B 37/021 (2013.01); C04B 37/023 (2013.01); C04B 41/009 (2013.01); C04B 41/4523 (2013.01); C04B 41/5155 (2013.01); C04B 41/88 (2013.01); B32B 2250/42 (2013.01); B32B 2457/08 (2013.01); C04B 2237/064 (2013.01); C04B 2237/366 (2013.01); C04B 2237/402 (2013.01); C04B 2237/60 (2013.01); C04B 2237/708 (2013.01); H01L 23/142 (2013.01); H05K 3/38 (2013.01); H05K 2203/128 (2013.01);
Abstract

A metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing same, wherein the method includes arranging a ceramic substrate in a mold; putting the mold in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold to contact the surface of the ceramic substrate; and cooling and solidifying the molten metal to form a metal plate for a circuit pattern of aluminum on one side of the ceramic substrate to bond one side of the metal plate for a circuit pattern directly to the ceramic substrate, while forming a metal base plate of aluminum on the other side of the ceramic substrate.

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