The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jun. 11, 2020
Dowa Metaltech Co., Ltd., Tokyo, JP;
Hideyo Osanai, Tokyo, JP;
Akira Sugawara, Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
There is provided an inexpensive metal/ceramic bonding substrate which has a metal circuit plate of aluminum or an aluminum alloy bonded directly to a ceramic substrate and which can prevent a large difference in level from being caused on portions corresponding to the grain boundaries of aluminum or the aluminum alloy even if heat cycles are repeatedly applied to the metal/ceramic bonding substrate, and a method for producing the same. In the preferred embodiment of a metal/ceramic bonding substrate, one side of a ceramic substrateis bonded directly to a metal base plateof aluminum or an aluminum alloy, and the other side of the ceramic substrateis bonded directly to one side of a first metal plate(for circuit pattern) of aluminum or the aluminum alloy, the other side of first metal platebeing bonded directly to one side of a graphite sheet, and the other side of the graphite sheetbeing bonded directly to a second metal plate (for circuit pattern)of aluminum or the aluminum alloy.