The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jun. 10, 2020
Applicant:
Dowa Metaltech Co., Ltd., Tokyo, JP;
Inventors:
Yukiya Kato, Tokyo, JP;
Hirotaka Kotani, Tokyo, JP;
Tatsuhiro Doi, Tokyo, JP;
Takao Tomiya, Tokyo, JP;
Hiroto Narieda, Tokyo, JP;
Assignee:
DOWA METALTECH CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 15/00 (2006.01); C25D 3/46 (2006.01); C25D 5/12 (2006.01); C25D 21/10 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C25D 15/00 (2013.01); C25D 3/46 (2013.01); C25D 5/12 (2013.01); C25D 21/10 (2013.01); H01B 1/02 (2013.01);
Abstract
There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.