The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Aug. 23, 2016
Dowa Metaltech Co., Ltd., Tokyo, JP;
Yazaki Corporation, Tokyo, JP;
Yuta Sonoda, Tokyo, JP;
Hiroto Narieda, Tokyo, JP;
Hideki Endo, Tokyo, JP;
Akira Sugawara, Tokyo, JP;
Hirotaka Kotani, Tokyo, JP;
Jyun Toyoizumi, Shizuoka, JP;
Takaya Kondo, Shizuoka, JP;
Yuya Kishibata, Shizuoka, JP;
Dowa Metaltech Co., Ltd., Tokyo, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
A tin-plated product contains: a substrateof copper or a copper alloy; an underlying layerof nickel which is formed on the surface of the substrate; and an outermost layercontaining tin, the outermost layerbeing formed on the surface of the underlying layer, the outermost layerbeing composed of a copper-tin alloy layerof a large number of crystal grains of a copper-tin alloy, tin layersof tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layersof a copper-nickel-tin alloy, each of the tin layersbeing formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layersbeing arranged on the side of the underlying layerin the copper-tin alloy layerso as to be apart from each other.